Compare Model Drawings, CAD & Specs Bearings Maximum Speed Weight Resolution Availability Price
Vacuum/pressure air bearing 400 mm/s 550 kg 2 nm


DynamYX Family of Air-bearing Stages

With the launch of the 300mm wafer initiative more than a decade ago, DynamYX was designed to provide equipment manufacturers in the semiconductor industry with a tool capable of achieving the highest levels of precision and throughput. DynamYX provides high resolution dynamic positioning of a wafer chuck or other similar substrate in two orthogonal translation axes from a single-plane carriage. A Vertical (Z) axis with Tip Tilt function and a rotary axis for wafer offset correction may be added on the carriage beneath the wafer chuck. Over the years, the form and function of DynamYX has evolved to keep pace with customer requirements. Today The DynamYX family consists of four specific designs each with their own specific features and benefits.

Position Feedback

The positioning loop on DynamYX may be closed using a single linear encoder for each axis. As shown in the adjacent illustration, the encoder measuring positions are closely located to the substrate’s surface reducing the already minimal abbe offset affect. For the X-axis, the linear scale is typically mounted to the underside of the bridge structure with the read-head in-line with the system’s optical path and affixed to the moving ceramic guide. System architectures that do not allow this configuration can be accommodated by mounting the X-axis scale to a supplementary SiC spar located at the rear side of the system. The Y-axis has its scale mounted to a small SiC bracket on the moving carriage. The read head is fixed to the arm of the L-shape structure. Read-heads which have fixed positions relative to the tool’s optical path are beneficial in optimizing precision. With an encoder signal period of 2mm, resolutions down to 0.1nm are possible with Newport’s XPS or SPS controllers each with internal 20,000 times interpolation. Equipped with linear encoders the DynamYX is an extremely accurate and very repeatable platform allowing for very high accuracy through error mapping. The geometric stability of the ceramic elements of these stages results in systems that can be mapped once at our factory then, upon installation, only require a simple length calibration to compensate for uniform thermal expansion. For applications where the accuracy requirements exceed the capabilities of error compensation, or in certain scanning modes where the absolute position of the stage must be the basis of a very precise trigger or latch, linear encoders must yield to laser interferometers which are also part of our offering.

Chuck Interface

The standard mounting interface includes three precision-lapped pads for the direct mounting of a wafer chuck. In the DynamYX 300 and GT stages, these three pads are only 66mm above the granite reference plane maintaining the low-profile nature of the stage. Even with the addition of other accessory components such as a 4-axis Z-Tip-Tilt-Theta stage the height of the wafer plane in the DynamYX GT stage is only 115mm above the granite reference surface. The low profile nature of DynamYX contributes to the system’s overall dynamic performance and attenuates the already minimal abbe offset effect of pitch and roll. If Newport is to supply the wafer chuck, the chuck (ideally ceramic), including vacuum lines to the chuck, and wafer lift pins may be supplied as an integrated solution.