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Spectra-Physics® Pulseo® products are a family of high-powered green and UV lasers: |
The Pulseo 532-34 is a Master Oscillator Power Amplifier (MOPA) laser that produces over 34 W of 532 nm output at 120 kHz with a pulse width of less than 30 ns - The Pulseo 355-20 is a MOPA laser that supplies greater than 20 W of 355 nm at 100 kHz, and a pulse width of less than 23 ns
- The Pulseo 355-10 offers the same key reliability and performance benefits as the Pulseo MOPA version, with an output of 10 W of 355 nm at 90 kHz, and a pulse width of less than 23 ns
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| Model | Wavelength | Peak Power | Average Power | Pulse Width | Repetition Rate (nominal) | | Pulseo 532-34 | 532 nm | >13.5 kW | >34 W | <30 ns at 120 kHz | 120 kHz | | Pulseo 355-20 | 355 nm | ~10 kW | >20 W | <23 ns at 100 kHz | 100 kHz | | Pulseo 355-10 | 355 nm | ~5 kW | >10 W | <23 ns at 90 kHz | 90 kHz |
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High Uptime |
The Pulseo family of rugged, industrial high power lasers are designed specifically for 24/7 operation, low maintenance and easier field serviceability. Reliability advantages include: |
Unique diode modules and fibers that can be easily replaced in the field- ProLite® diodes that last up to double the industry average
- Unique field-replaceable laser output window to allow operation in typical industrial environments which are subject to contamination and airborne particulates generated from the ablation process
- Rugged I-beam laser housing and EternAlign™ optics protect the laser during vibration and shipping to ensure proper alignment over the life of the laser
- ALPS - Our unique Active Laser Purification System™ maintains the laser cavity clean and dry over the life of the laser to significantly extend laser life
- Data Logging - to log key performance parameters over time and provide a powerful service feature and product reliability tool
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With our commitment to quality and reliability, the Pulseo lasers offer the best in industrial reliability — higher uptime, lower mean time to repair (MTTR), and a lower cost of ownership. |
Superior Performance |
Pulseo lasers also lead the industry in performance. With their shorter pulse widths, Pulseo lasers have higher peak powers resulting in cleaner scribing, and less thermal damage to your parts. And, excellent near- and far-field beam pointing stability and superior pulse-to-pulse stability translate to more consistent processing results and higher yields.
The integrated E-Pulse™ feature allows users to tailor the overall pulse energy to the specific job on hand. To ensure consistent machining quality and dependability over the lifetime of the laser, we’ve also integrated an automatic crystal shifter which keeps the output power constant. Finally, the Pulseo laser’s Active Laser Purification System™ keeps the air in the laser cavity pure by both filtering and drying it to prevent burn spots on the optics which can result from component out-gassing. |
Ease of Use |
The Pulseo laser is significantly smaller than competitive high power DPSS lasers ensuring simple integration into any machine tool. With its intuitive GUI, automated command set and superior laser design, the Pulseo laser is nearly maintenance free, requiring much less user intervention and far fewer tweaks to keep constant power, beam quality and throughput than other lasers on the market today.
Pulseo lasers ensure the best product reliability, value, laser performance, cost of ownership, and ease of use. |
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| Industry | Application | Lasers | | Solar Cells | | | c-Si doping using PSG as precursor | Pulseo 532-34 | | | c-Si wafer scribing/dicing | Pulseo 355-20 | | | c-Si solar cell edge isolation | Pulseo 355-20
Pulseo 532-34
Pulseo 355-10 | | | Laser drilling of Metal Wrap Through (MWT) and Emitter Wrap Through (EWT) via holes | Pulseo 355-20 | | | Laser scribing, including thin films, ARC layer, laser grooved buried contacts | Pulseo 532-34
Pulseo 355-20 | | Flip Chips, Flexible Circuits and Printed Circuit Boards | | | Via hole drilling | Pulseo 355-10
Pulseo 355-20 | | | Flex circuit cutting, drilling | | | PCB singulation | Pulseo 532-34 | | | Ablating material on PCBs and PCB structuring | | | Electronic package singulation | | LED Manufacturing | | | Scribing/dicing of sapphire, GaAs, GaN | Pulseo 355-10 | | Silicon Processing | | | TSV (through silicon via) drilling | Pulseo 355-20 | | | Wafer scribing/dicing | | | Low K dielectric scribing/grooving | | | Silicon micromachining and ink jet cartridges | Pulseo 532-34 | | Flat Panel Display Manufacturing | | | LDP/LDI, repairing LCD/PDP, and PDP/AM OLED processing | Pulseo 355-10
Pulseo 355-20 | | | Vacuum hole drilling, glass cutting | Pulseo 355-20 | | | ITO patterning | Pulseo 355-10
Pulseo 355-20 | | Ceramic Processing | | | Scribing | Pulseo 532-34
Pulseo 355-20 | | | Drilling ceramic foils | Pulseo 532-34
Pulseo 355-20 |
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