Via Hole Drilling for Flip Chips, Flexible Circuits and Printed Circuit Boards
The demand for small, hand-held electronics with more features is driving smaller, more dense, stacked circuits and electronic packages, which require smaller via holes, typically <65 µm. Laser drilling offers the lowest manufacturing cost and highest throughput for both blind vias and through holes for printed circuit boards, flexible circuits, and flip chip packages.
The Pulseo laser family is the perfect tool for via drilling and PCB structuring. Available in both
532 nm and 355 nm for maximum absorption over a wide range of materials, the Pulseo laser’s short pulse width, high peak power, and high repetition rate translate to clean processing, round holes, faster throughput, and less thermal damage to the parts.
PCB Via Entrance (left) & Exit (right) Details
Laser drilled holes in flexible circuit material (8 µm Cu / 24 µm Polyimide / 8 µm Cu) yield
small, round holes with little thermal damage to the surrounding area.