Spectra-Physics OEM Laser Solutions

Spectra-Physics is an industry-leading global supplier of proven advanced laser solutions to the microelectronics, solar, semiconductor, display, industrial manufacturing and life and health sciences markets.

Industrial Laser Experts in Microelectronics
LED Scribing • Narrow scribe widths for increased die count • Reduced chipping/micro-cracking for improved yield and device reliability • Non-contact process and low cost of operation
Package Singulation • Flexible cutting for curves, notches and diagonals • Narrow, high quality scribes • High throughput and low cost of operation
ITO Patterning • Touch screen and flat-panel patterning • Non-contact process for improved yield • High throughput with high processing speeds • No post-processing and high repeatability
Via Hole Drilling • PCB, flex circuit, flip-chip and TSV • Small, precise holes with UV lasers • Rapid drilling for high throughput
Wafer Scribing/Dicing • Low-k dielectric scribing and thin-wafer high-speed cutting • Reduced chipping / micro-cracking for improved yields • Smaller kerf width for improved cut quality / yields
Wafer Inspection • Yield enhancement in semiconductor manufacturing • UV illumination for precise defect identification • High reliability for low cost of operation
Many Other Laser Processes • Flex circuit cutting and drilling • Ceramic and glass scribing and cutting • Flat panel repair, titling, annealing and sealing • Stereolithography and rapid prototyping • Circuit and component repair and trimming • Marking and titling

Leader in Industrial Lasers for Photovoltaics
Laser Doping • LDSE (laser doping of selective emitter) • Using spin/spray on dopant or PSG as doping precursor • Boost cell efficiency with reduced shading and improved contact resistance
Laser Drilling • MWT (metal wrap through) and EWT (emitter wrap through) • Reduced shading for improved efficiency • Simplified cell-to-cell interconnect with back contacts
Laser Edge Isolation • Narrow grooves with minimum edge loss for improved cell efficiency • Non-contact process for improved yield • High throughput with high processing speeds • No post-processing and high repeatability
Laser Scribing • Thin film scribing of P1/ P2 / P3 layers of a-Si tandem junction, CdTe, CIGS • c-Si anti-reflective coating removal • Laser grooved buried contacts • High throughput, high yield
Laser Wafer Singulation • Higher cutting speed on thin wafers • Reduced chipping / micro-cracking for improved yields • Smaller kerf width for improved cut quality / yields
Laser Defect/Shunt Repair • Isolation of defects and shunts • Yield recovery through repair • Non-contact process

Leader in Lasers for Life and Health Sciences
Multiphoton Imaging1	CARS Imaging	Confocal Microscopy	Multimodal Imaging1
Flow Cytometry	Microarray Scanners	DNA Sequencing	Photoacoustic Imaging2

1. 1. Data taken by Dr. Claudio Vinegoni at Center for Systems Biology, Massachusetts General Hospital.
2. 2. Image courtesy of the Photoacoustic Imaging Group, a sub-group of the University College of London’s Biomedical Optics Research Laboratory, BORL.

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