The MRSI-605 Assembly Work Cell sets the standard for ultra-precise, high-speed component assembly. Offering advanced vision and fully automatic operation, the system is specially designed and configured for advanced packaging solutions required for semiconductor packaging, life and health sciences, aerospace, defense, automotive, and communications applications.
The MRSI-605 uses an overhead solid granite platform that supports the placement head from above. This provides a large work envelope that is easily tailored for customer-configured systems. The major system axes use brushless DC linear servo motors with linear glass-scale encoder feedback for high speeds and accurate movements.
The systems closed-loop force control of die placements enables placing delicate Gallium Arsenide (GaAs) die with as little as 10 grams of force. Using programmable higher forces, the system is also capable of eutectic bonding with complete scrub and temperature control. For applications such as these, die are picked from waffle pack, Gel-Pak, wafer, and tape and reel. The MRSI-605 is also configurable with epoxy dispense pumps and epoxy stamping for a complete assembly solution.
The MRSI-605 operates on Newports Windows workcell software. This user-friendly software operates all Newport Advanced Packaging Assembly and Dispense systems and provides excellent process control and extensive interchangeability with other Newport Advanced Packaging equipment.
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605 Die Bonder Video
MRSI-605 Product Advantages
360° Die Orientation
The MRSI-605 features an advanced vision system that enables the rapid detection and orientation of die over a full 360°. Boundary trace or pattern match is used to locate the die center or application critical features. This fast orientation enables die such as MMICS and lasers to be used directly from the supplier without any need for pre-orientation.
Closed-loop force feedback enables delicate handling of Gallium Arsenide (GaAs) and Indium Phosphide (InP) devices as well as MEMS devices with fragile microstructures. Die are placed with forces as low as 10 grams. Force is programmed per placement so that each die can be placed with an optimized force.
Waffle Packs Gel-Paks
The large open work area ensures there is always enough room to hold the components necessary for the job. The system holds 90 2 x 2 waffle packs or a mix of 2 x 2 and 4 x 4 waffle packs. Gel-Paks are easily used with an integrated vacuum pull down system.
Pick from multiple 8 wafers. Wafer mapping and ink dot detection enable factory integration and rapid wafer change.
The MRSI-605 features either a thirteen-position tool bank with automatic tool change or a six-position tool turret with independent force control for each tool. Additional tool change banks are added so that a wider range of tools is available. The tool change banks hold round surface pick-up tips as well as perimeter and inverted pyramid collets. The turret uses standard MRSI-605 tips including perimeter collets and pyramid collets for eutectic bonding.
Programmable ring and collimated lighting combined with Newports robust machine vision system enable the automatic processing of the most challenging materials. Global and local vision alignments are used for nested substrates and features. This enables fast, error-free processing of complex assemblies.
Lighting intensity is programmable for both the ring and collimated lights for each camera. The optimal setting of lights is determined while teaching die and alignments. That setting is used by the system while in production. Different settings are used for each die for vision step such as finding the die in the waffle pack and then locating alignment fiducials on the die surface. Red, green and blue programmable lighting makes the system much more robust while processing challenging alignment surfaces such as gold on alumina. The more robust vision system means production is not interrupted for missed alignments.
The MRSI-605 is equipped with eutectic bonding capability. This capability includes the addition of a 1.5"x3" hot plate reflow station with fast temperature ramping capability. A heated cover gas of Hydrogen and Nitrogen is present over the hot plate. The system automatically transports the substrate or package to and from the stage for eutectic stage for bonding. The design of the hot plate reflow station includes provisions for vacuum hold down.
The eutectic station is programmable to match the requirements of the eutectic process. The temperature ramp rates are programmable to optimize the heating of the parts while avoiding thermal shock. Multiple temperatures are programmed to bring the substrate to a base temperature before the final rise to the reflow temperature once the part is placed. A mechanical scrub is programmable to optimize bonding quality.
Progressive Heated Boat Indexer
The highest eutectic throughputs are achieved with the MRSI-605 configured with a progressive heated boat indexer. The conveyor transfers the boat to the bonding area as it incrementally heats the package to the process temperature by passing over preheat zone positions and then clamps the package at the eutectic assembly stage. The substrate is bonded at this point without being lifted to a separate assembly stage. After bonding, the boat is indexed so that the next preheated part is presented to the stage for bonding. The boat travels through a tunnel of hydrogen-nitrogen cover gas to prevent oxidation.
Material Handling Systems
The MRSI-605 processes boats, custom trays, and lead frames as part of a fully integrated SMEMA production line. Or the system stands alone and operates cassette to cassette. A fixed stage is used to build parts in a tray when the system is in a non-conveyor mode for users with a wide product mix.
Two dispense pumps are mounted on the robot head for a complete assembly solution. Cartridge style positive displacement pumps are used with closed loop servo motors. This provides precise control of epoxy volume when dispensing small dots or area fills.
A rotating stamping well with multiple epoxy grooves presents epoxy for stamping. Stamping (or daubing) tools are interchangeable with standard pickup tools and are used to create very small epoxy dots by touching down in the stamping well and then on the substrate. Dots as small as 0.004 (100 microns) are possible or ganged stamping tools can be used to place multiple sots simultaneously.
An automatic homing routine occurs at machine startup, otherwise no routine calibration is necessary.
Newport Windows Workcell Software
The MRSI-605's intuitive graphical user interface, running on Windows simplifies the set-up and production process. The XML database is shared by all taught programs so that die and waffle packs taught for one job are available for others. Die and substrate teaching are wizard guided and are taught and edited in just minutes. Some die bonding specific features include:
- Alternate die allows for the automatic substitution of different appearing die from an alternate vendor
- Traceability Software tracks each die and creates a record of all die used per substrate. Process parameters such as force and temperature are also recorded. The traceability file is formatted as comma delimited or XML and can be automatically uploaded to a network server.
- Tip overlay indicates the true size of the pick up tip while teaching the pickup location of a die to avoid air bridges.
- List view presents a list of all placement locations and parameters in a spreadsheet format for easy comparison and tuning.
- Production optimization is achieved by performing all the alignments at the start of production to enable unmonitored production.
Six position turret with independent force controlHigh throughput eutectic bonding with the progressive heated boatLarge work area for 90 waffle packs and waferDual magnification cameras with programmable intensity ring and collimated lighting for robust visionMultiple epoxies with multiple stamping tools enable stamping of a large variety of dot materials and sizesFlip Chip bonding using the up-looking cameraDirect pick from multiple eight inch wafers with delicate force control.
||Microwave modules, hybrids, optical modules, epoxy die attach, eutectic die attach
|XY Axis Accuracy
||10 microns, 3 sigma
|Z Axis Accuracy
||Place to a force
||Brushless DC Linear Motors with glass scales encoders
||Programmable per placement - 10 grams to 2 Kg
||Edge detection and pattern match
||2 down looking - 1 up looking
||Edge detection and pattern match
||Ring or collimated, Programmable intensity
||13 Tips in standard tip change bank. Multiple banks are optional. Also holds stamping tips.
||Perimeter collets, inverted pyramid collets, plus custom
||Optional 6 tip turret with independent force control per tip
||Up to 90 2 x 2 inch waffle or Gel-Paks or 4 x 4 inch
|Tape and Reel
||Up to 5 tape and reel bases with multiple reels each
||Programmable ramp rates up to 450° C
||Nitrogen, Argon or N2-H2 or Ar-H2
||Programmable plus library of customizable scrub motions
||2 Cartridge style, rotary, positive displacement pumps
|Height Sensing (dispense)
||3 Point laser height mapping of substrate plane
|Dispense Needle Clean
||Automatic, programmable occurrence between dispense patterns
|Dispense Needle Calibration
||Automatic software calibration routine using through beam sensors